Every time the analyst Ming-Chi Kuo of the security company lKGI publishes a new report for investors, the alarms go off. Thanks to your contacts and sources on Apple’s assembly lines, you can predict quite reliably what Apple’s next big moves will be.
Currently, Apple already uses its own flexible circuits, but it does so on its flagship device, the iPhone. Specifically, the iPhone 8 and iPhone X have a new flexible circuit board made with liquid crystal polymer.
To understand, a circuit board own and more advanced than traditional. On the other hand, the iPhone X also has this technology in the TrueDepth camera circuit.
Why does Apple want to expand the use of this technology? For its speed, the physical space that is saved and the long-term possibilities.
According to Ming-Chi Kuo, Apple is thinking about this technology to be able to use higher data transmission specifications: USB 3.2 for example. Right now the current MacBook does not face the speeds required by this protocol.
In order to respond to future hardware design requirements (for example, saving more internal space) and to keep up with possible updates to the data transmission specifications (for example, USB 3.2), we believe that Apple is working with Career, your FPCB provider for MacBook, in the exploration of LCP FPCB designs for future MacBook models.
In front of the users, the significant change will see it in the speed mainly. If Apple releases new models of MacBook this year with such improvements in the circuits, they will be adapted and will be able to accept much higher transmission speeds.
On the other hand, Apple may reduce even more the space occupied by the rest of components other than the battery, giving, even more, autonomy to the devices.
Via | AppleInsider
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